Job description
We live in a mobile driven world where technology is constantly improving. Semiconductor manufacturers need a partner as they pioneer and drive the most advanced integrated circuits (ICs) ever made. FormFactor is the world’s leading supplier of semiconductor test and measurement products used to test the ICs that power the majority of smart phones and tablets on the planet, as well as electronic systems used in computing, consumer, automotive, Artificial Intelligence (AI) and other applications. We are a big company with a small time feel. Working at FormFactor gives you the opportunity to work with cutting edge technology, have a direct influence on next generation products hitting the market and drive the overall growth and development of the semiconductor industry.
We are a fast-paced, agile, growing company that values diversity of thought and constantly strives for a more diverse, inclusive environment. We are looking for enthusiastic, talented individuals who can thrive in a changing and challenging environment.
- Improve Probe Bonding first pass yield with yield Pareto analysis and corrective actions implementation.
- Sustain probe bonding manufacturing process, including Bonder equipment UP time, 1st article bonding recipe, bonder monitoring check list, OCAP and work instruction/travelers update per improvement results.
- Support probe bonding training tasks to meet ramp up hiring plan.
- Assist R&D engineering team to continuously improve Pactech bonder UP time upgrade and implement new bonding recipes into production.
- Perform process characterization, establish process controls for all critical process parameters, support process development, drive to improve yield and reduce cost for our advanced MEMS probe assembly process.
- Projects include yield improvement, disposition of non-conforming materials, response to out-of-control process, and qualification of new equipment and processes that are being introduced into the manufacturing line.
- Perform supporting activities for engineering and manufacturing including 5S and Lean manufacturing activities, material handling improvements, production line configuration, and safety procedures
- Self-starter with ability to lead a project from lab scale development to high volume production
- Hands-on experience in the development of module processes & its integration in packaging, semiconductors, or other related industries
- Ability to perform process recipe DOE, data analysis, SPC control
- Ability to conduct failure mode analysis, root cause investigation, and problem solving for product yield and quality issue and working with equipment manufacturers for both equipment hardware and software issues
- Excellent written & verbal communication skills and demonstrated leadership ability
- Project Management- Excellent data handling, documentation, critical milestone creation, and organization skill
- B.S. degree in Mechanical Engineering, Industrial Engineering, Material Science, or Engineering with 5+ years of process engineering or manufacturing experience
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