Job description
Summary:
- Operates Assembly and Test Equipment used in the Backend Assembly of Semiconductor electronic components.
Specific Responsibilities:
- Perform various duties in the assembly and test processes including:
- Operate/Run Production Equipment
- Perform Die Attach, Wire Bonding, Sealing, Laser Marking, RF-Testing, Packaging and Tape & Reel processes
- Load /Unload Equipment to perform these tasks
- Sue microscope to inspect products
- Must be able to lift up to 10 pounds
- Use computer skills to enter data into database
Requirements:
- High school diploma or equivalent
- Ability to work in a fast-paced manufacturing environment
- Ability to effectively work in a class 10,000 cleanroom environment
- Some flexibility to work assigned shift and alternate shift as business needs require (1st shift and 2nd shift)
- Basic computer skills to perform data entry during the inspection procedures
Preferred Experience or Skills:
- 1-year experience in device assembly preferred (not required)
- Experience in the following areas preferred, but not required:
- Die Attach / Datacon Equipment preferred
- Wire Bonding / H&K Equipment preferred
- Experience in Testing of Integrate Circuits / Automatic and/or Manual Testing
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