Summary of Role:

We are seeking an experienced candidate with a foundation in device physics to join our team. The successful candidate will work on all aspects related of semiconductor devices for the primary application of thermal inkjet printing. Primary duties will include development of new semiconductor device designs and drive improvements in fabrication, packaging and processing of thermal inkjet devices.

Responsibilities:

• Apply software tools to design and model performance of semiconductor devices

• Design, measure and characterize semiconductor devices and test structures

• Collect measurement data and propose process changes to optimize devices

• Work closely with team members in circuit design, wafer processing & packaging to develop new semiconductor device design

• Design and conduct experiments to demonstrate new device performance and reliability

• Design, implement, and characterize ESD protection devices and strategies for various IC products and interconnect systems

• Extract and maintain spice model libraries for semiconductor devices

• Work with foundries to add new devices and their models for design tools and to analyse device issues and drive appropriate improvements

Education and Work Experience:

• Minimum of MS, PhD preferred, in Electrical Engineering, Physics or related scientific discipline

• 5+ years of industry experience for senior level, or equivalent

• Experienced designing semiconductor devices, particularly high voltage, power, non-volatile, and ESD

• Experience with semiconductor device and process modeling software such as Sentaurus, Victory, Cogenda

• Experience with semiconductor modelling software such as Utmost IV and IC-CAP

• Experienced with software such as JMP, Tableau, SPSS, Python, and Matlab

• Knowledgeable in semiconductor fabrication, device testing and packaging

#LI-Post